SMTA International Conference Proceedings


MASS IMAGING OF LEAD FREE MATERIALS - WHAT IMPACT DOES STENCIL TECHNOLOGY HAVE?

Author: Clive Ashmore
Company: DEK Printing Machines
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Many studies have analysed the impact lead free solder pastes will have on aspects such as joint strength and compatibility within the manufacturing process. Numerous studies using lead-rich materials have already identified the major parameters influencing the mass imaging process. However, the material used to replace the lead (Pb) component changes the solder paste properties and therefore the characteristics of the print medium.

This paper therefore investigates the process window for mass imaging of lead-free materials, with particular emphasis on the behaviour of various stencil materials and manufacturing technologies when used with well-known lead-free solder paste formulations. A comparison between mass imaging using squeegees or Enclosed Head technology is also explored.

Keywords: Leadfree, Printing process, ProFlow, Stencils.



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