SMTA International Conference Proceedings


THE USE OF CLOSED-LOOP PROCESS CONTROLS IN DISPENSING APPLICATIONS

Author: James Klocke
Company: ASYMTEK
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Many of today’s consumer products use some form of adhesive, epoxy, or sealant in their assembly. Many of these materials give these products a greater reliability than any other form of fastening. However, these materials have rheological characteristics that make them difficult to use in a dispensing process. These characteristics are elasticity, plasticity, and viscosity. Changes in viscosity due to time, relative temperature and humidity can cause changes to the material. When such a change occurs in a dispensing process, the volume or amount of material deposited onto the product will vary.

The following test and results will demonstrate that an assembly fluid, a two-component epoxy adhesive, will change in viscosity over time and cause a direct change in the amount being deposited. Also, this study will show how a simple weight measurement can be used to calibrate a dispensing process.

Key words: viscosity, dispensing, adhesive, epoxy, sealant.



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