SMTA International Conference Proceedings


MEASUREMENT VARIATION IN THE FILL OF INTRUSIVELY REFLOWED LEAD FREE SOLDER JOINTS WITH DIFFERENT BOARD FINISHES BY X-RAY INSPECTION

Author: David Bernard et al.
Company: Dage Precision Industries
Date Published: 9/25/2005   Conference: SMTA International


Abstract: As the implications of switching to using lead-free materials for printed wiring board (PWB) assembly have particular impact on the equipment and capability for wave soldering, it is attractive to consider the applicability of using the pin-in-hole intrusive reflow technique as an alternative within the production environment. Eliminating wave soldering can reduce the cost of implementing leadfree and some of the common process defects.

This paper will report on the results from percentage-fill measurements of intrusively reflowed lead-free solder joints, where the same lead-free alloy has been applied to boards with different finishes. The design rules, hole size and other factors associated with intrusive reflow defect elimination will be outlined and compared with the intrusive reflow requirements in the latest IPC 610-D standard. The measurements have been taken by x-ray inspection at oblique angle views.

Variation in the fill percentage of the solder joints after reflow will be discussed in terms of the nature of the board finishes used and the conditions that are applied when optimising the complete pin-in-hole intrusive reflow process.

Key words: Pin-in-hole reflow, intrusive reflow, lead-free, design rules, board finish, fill-percentage, x-ray inspection



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