EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGH- TRANSMISSION IMAGINGAuthor: Janet Semmens
Company: Sonoscan, Inc
Date Published: 1/25/2000 Conference: Pan Pacific Symposium
Acoustic microscopes utilize high frequency ultrasound to examine the internal features in materials and components. The analysis methods presented in this study include through- transmission and three-dimensional reconstruction of the devices. Both techniques render the entire volume of the component visible. Through- transmission can image the entire thickness of the part/board assembly in one scan but the information is not level specific. The 3V method reconstructs a virtual part from individual, focused reflection mode scans taken at specific depths in the device or assembly. The part can be repeatedly sectioned and reassembled to gain a three- dimensional perspective of the features and flaws within a device. The combination of the analysis techniques allows for accurate detection and detailed characterization of any flaws that are present in the underfill. The information can then be used to help determine optimum process parameters for underfill dispensing. AMI can be used as well for inspection to monitor the process after set up and for quality control applications.
This paper will discuss the 3V reconstruction and through-transmission techniques and how they are applied to analyzing underfill in flip chip and BGA attach.
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