THE EFFECT OF SURFACE FINISH ON THE RELIABILITY OF PB-FREE SOLDER JOINTS IN CHIP SCALE PACKAGESAuthors: Corey Reichman and Robert Darveaux
Company: ASU and Amkor Technology
Date Published: 9/25/2005 Conference: SMTA International
The dye-and-pry revealed similar failure modes between the IAg and OSP finish. Both finishes saw packages with trace failures and delamination to the underside of the copper pad. Neither case was prevalent in the Ni/Au finish. It is possible that the delamination on these two surface finishes could be the result of a chemical attack process that occurred when the vendor originally put down the surface finish. As a result, the integrity of the copper was compromised and resulted in the deterioration of the pad and trace.
Key words: Pb-free solder, CSP reliability, surface finish
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