FILLING BLIND MICROVIAS TO IMPROVE RELIABILITYAuthors: Dennis Fritz, Jim Watkowski, and Maria Nikolava
Company: MacDermid Incorporated
Date Published: 9/25/2005 Conference: SMTA International
Organic additives, fluid delivery systems, and bath age are correlated with results. This illustrates a high capability of filling a large range of micro via geometry, without requiring large capital investment in periodic pulse plating rectification. The filling capabilities demonstrated enable a highly reliable stacked via construction.
Keywords: Via Fill, Copper Electroplate, Fill Ratio, Void Elimination
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