SMTA International Conference Proceedings


Authors: Dennis Fritz, Jim Watkowski, and Maria Nikolava
Company: MacDermid Incorporated
Date Published: 9/25/2005   Conference: SMTA International

Abstract: Via-in-pad construction is an important new way to increase routing density of microvia multilayer circuit boards. However, voids in the BGA solder joint (impacting reliability), can be caused by via-in-pad construction. This paper explores electrolytically filling microvias with electroplated copper, and why this improves reliability.

Organic additives, fluid delivery systems, and bath age are correlated with results. This illustrates a high capability of filling a large range of micro via geometry, without requiring large capital investment in periodic pulse plating rectification. The filling capabilities demonstrated enable a highly reliable stacked via construction.

Keywords: Via Fill, Copper Electroplate, Fill Ratio, Void Elimination

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