EVALUATION OF OSP SURFACE FINISHES FOR LEAD-FREE SOLDERING
Authors: David Geiger, Yueli Liu, and Dr. Dongkai Shangguan Company: Flextronics Date Published: 9/25/2005
Abstract: As the move to lead-free soldering continues, the suitability of Organic Surface Preservative (OSP) as a surface finish for lead-free soldering processes becomes a subject of great interest. This work will evaluate the printability, wetting, voiding and cosmetics of a new high temperature OSP vs. traditional OSP finishes. Multiple factors are included in this evaluation, including pre-conditioning/aging of the boards, mis-print cleaning, reflow environment and peak temperature. The results will be discussed in comparison with other PCB surface finishes.