RELIABILITY AND SOLDERABILITY OF THE LEAD FREE HASL PROCESSAuthor: Glenn Sikorcin
Company: Florida Cirtech, Inc.
Date Published: 9/25/2005 Conference: SMTA International
In view of the lead free switch, there were concerns that changing the HASL process to lead free might not be viable due to the perceived higher process temperatures that would be required. There is now that lead free HASL will be an option for future board surface finishes.
This paper has been developed to discuss the factors that affect the lead free HASL process including reliability, tin whisker testing, solderability and thermal fatigue results compared to conventional tin/lead HASL.
Key words: HASL, Lead Free, Tin/copper/nickel, Board finishes, tin whiskers, solderability.
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