SMTA International Conference Proceedings


RELIABILITY AND SOLDERABILITY OF THE LEAD FREE HASL PROCESS

Author: Glenn Sikorcin
Company: Florida Cirtech, Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: With lead free legislation rapidly expanding from Europe and Japan to other countries, making the switch to lead free requires all aspects of the assembly process to be converted. The printed circuit board has a number of viable surface finishes that will meet the lead free requirements. The only surface finish that has to be modified to continue to be used is the popular tin/lead hot air solder level (HASL) surface.

In view of the lead free switch, there were concerns that changing the HASL process to lead free might not be viable due to the perceived higher process temperatures that would be required. There is now that lead free HASL will be an option for future board surface finishes.

This paper has been developed to discuss the factors that affect the lead free HASL process including reliability, tin whisker testing, solderability and thermal fatigue results compared to conventional tin/lead HASL.

Key words: HASL, Lead Free, Tin/copper/nickel, Board finishes, tin whiskers, solderability.



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