SMTA International Conference Proceedings


Author: Arun Gowda et al.
Company: GE Global Research Center
Date Published: 9/25/2005   Conference: SMTA International

Abstract: Thermal Interface Materials (TIMs) play a key role in the thermal management of microelectronics by providing a path of low thermal impedance between the heat generating devices and the heat dissipating components (heat spreader/sink). Thermal greases are TIM solutions that are widely utilized in the industry for the cooling of microelectronics. Thermal greases provide a low thermal resistance path due to their ability to penetrate into the surface features of heat spreaders/sinks and silicon die.

In addition, thermal greases do not require post-processing. However, some of the disadvantages associated with thermal greases are their tendency to "dry-out" and "pumpout" during prolonged periods of operation. Several factors affect the in-situ performance of thermal greases, one of them being the surfaces that interface with the grease (heat spreader/sink and silicon device or heat sink and heat spreader). In this paper, the effect of the surface characteristics of heat spreader/sink and silicon device on thermal and reliability performances is reported. The thermal and reliability tests designed for this study are also described.

Key words: Thermal grease, reliability, accelerated testing

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