RELIABILITY AND PERFORMANCE OF THERMALLY CONDUCTIVE ADHESIVESAuthor: Dr. Brian J. Toleno
Company: Henkel Corporation
Date Published: 9/25/2005 Conference: SMTA International
If the material performs poorly in either function the device can fail. Therefore, these materials need to maintain the same level of adhesion and thermal performance over time, under various stress conditions, and between different surfaces. In this paper we present data measuring adhesion and thermal performance of different thermally conductive adhesives such as activated acrylics, bismaleimide (BMI) polymers, and a new bead on bead thermally conductive adhesive.
The data presented includes adhesion and thermal performance on different combinations of plastic mold compounds, aluminum, silicon, and ceramic after various stress conditioning.
Key words: Thermal Adhesives, Reliability
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