SMTA International Conference Proceedings


Author: Dr. Brian J. Toleno
Company: Henkel Corporation
Date Published: 9/25/2005   Conference: SMTA International

Abstract: As electronic devices become smaller and their functionality increases thermal management becomes more critical. One method of managing thermal performance is to use a thermally conductive adhesive between the heat generating devices and the heat dissipating components (heat sink). These thermally conductive adhesives serve two functions: first to bond the device to the heat sink; and secondly to allow a thermal pathway between the device and heat sink.

If the material performs poorly in either function the device can fail. Therefore, these materials need to maintain the same level of adhesion and thermal performance over time, under various stress conditions, and between different surfaces. In this paper we present data measuring adhesion and thermal performance of different thermally conductive adhesives such as activated acrylics, bismaleimide (BMI) polymers, and a new bead on bead thermally conductive adhesive.

The data presented includes adhesion and thermal performance on different combinations of plastic mold compounds, aluminum, silicon, and ceramic after various stress conditioning.

Key words: Thermal Adhesives, Reliability

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