SOLDER AS THERMAL INTERFACE MATERIAL FOR HIGH POWER DEVICESAuthors: Fay Hua and Carl Deppisch
Company: Intel Corporation
Date Published: 9/25/2005 Conference: SMTA International
Therefore, limiting void formation in the solder joints during reflow is a significant challenge; 3> Solders are stiffer than polymer TIMs in general. In order to minimize the stress level in the package and also meet solder joint reliability requirements, specific mechanical properties are required; 4> There is no back side of die metallization needed for polymer TIM, thus a challenge remains to directly solder onto non-metallized silicon die, or an additional back side metallization will be needed.
This paper summarizes the key technical benefits and challenges of using solder as a thermal interface material for high power devices through solder selection and reliability evaluation.
Key words: solder thermal interface material, thermal materials, flux.
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