REPLACEMENT OF WIRE-BOND INTERCONNECTS FOR DIRECT CHIP ATTACH OF POWER SEMICONDUCTORSAuthor: Todd P. Oman
Company: Delphi Corporation
Date Published: 9/25/2005 Conference: SMTA International
A method to achieve the top-side interconnects without the shortcomings of the wire-bond process has been developed and will be referred to as bar bond. This method of connection is compatible with both high and low power devices. Bar bond is also compatible with existing surface mount process flows and equipment. Too minimize cost, a goal of bar bond is to not rely on encapsulation or epoxy underfill to maintain solder joint integrity. Reliability testing has demonstrated that this method exceeds the automotive goal of a minimum life of 1000 thermal cycles for temperature extremes of -40 to +150ºC .
Key words: power semiconductor, solder joints, direct chip attach.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.