MODELS FOR THERMO-MECHANICAL RELIABILITY TRADE-OFFS FOR LEADED AND LEADFREE FLIP-CHIP ELECTRONICS IN EXTREME ENVIRONMENTSAuthor: Pradeep Lall et al.
Company: Auburn University
Date Published: 9/25/2005 Conference: SMTA International
Modeling tools and techniques for assessment of component reliability in extreme environments are scarce. Previous studies have focused on development of modeling tools at sub-scale level. The tools are often available only in an offline manner for decision support and risk assessment of advanced technology programs. There is need for a turn key approach, for making trade-offs between geometry and materials and quantitatively evaluating the impact on reliability. Application of flip-chip assemblies and underfills in benign office environments and wireless applications is not new, however their reliability in extreme environments is still not very well understood.
The perturbation approach presented in this paper enables higher-accuracy model prediction by perturbing known accelerated-test data-sets using models, using factors which quantify the sensitivity of reliability to various design, material, architecture and environmental parameters. The models are based on a combination of statistics and failure mechanics. In addition, parameter interaction effects, which are often ignored in closed form modeling, have been incorporated in the proposed hybrid approach. The statistics models are based on accelerated test data in harsh environments, while failure mechanics models are based on damage mechanics and material constitutive behavior. Convergence between statistical model sensitivities and failure mechanics based model sensitivities has been demonstrated. Predictions of sensitivities have also been validated against the experimental test data.
Keywords: flip-chip, reliability, life-prediction, closed-form models.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.