FILLET WETTING AND DIE COLLAPSE OF WAFER-LEVEL FLIP CHIP ASSEMBLIESAuthors: Stephen C. Busch and Daniel Baldwin, Ph.D.
Company: Georgia Institute of Tech.
Date Published: 9/25/2005 Conference: SMTA International
Wafer-level underfill fillet formation is considered and explained in detail, with the evolution of fillet profiles being studied theoretically and experimentally. The constraints on fillet shape at various points in the collapse of wafer-level flip chip die have been identified. Mechanisms for die misalignment are identified, and experimental samples are fabricated and observed during collapse with video imaging. Having verified a cause for wafer-level flip chip misalignment, recommendations are made to reduce or eliminate the defect.
Key words: Wafer Level Packaging, Wafer Applied Underfill, Flip Chip, Underfill, Flip Chip Processing
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