EFFECT OF FLUX AND COOLING RATE ON MICROSTRUCTURE OF FLIP CHIP SAC BUMPAuthors: Dr. Wusheng Yin and Dr. Ning-Cheng Lee et al.
Company: Indium Corporation of America
Date Published: 9/25/2005 Conference: SMTA International
However, the effect of flux chemistry exhibits a greater effect than the cooling rate. Therefore, selecting a flux may not only affect solder wetting, but also may affect the microstructure of solder joints. Intermetallics appear to remain constant, therefore are a non-factor in this study.
Key words: Solder, flux, cooling rate, flip chip, microstructure, bump, lead-free, SnAgCu
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