SMTA International Conference Proceedings


SOLDER-JOINT RELIABILITY AND BOARD ASSEMBLY OF PQFN PACKAGES

Author: Terry Burnette et al.
Company: Freescale Semiconductor, Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Power Quad Flat No-Lead (PQFN) packages are for power semiconductor devices in a reduced package size to replace the larger typical HSOP packages. PQFN packages have unusual solderable surface areas in shape and a range of sizes on the same package. The combination of large exposed pads for power and for thermal dissipation and small IO pads raises questions about assembly to board and solder-joint reliability.

The results of experiments for both assembly and for solder-joint reliability show that PQFN packages can be successfully assembled to boards and that the solder-joint reliability for the packages is acceptable for a wide range of consumer and automotive products.

Key words: QFN, PQFN, leadless, solder-joints, reliability, HSOP



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