SOLDER-JOINT RELIABILITY AND BOARD ASSEMBLY OF PQFN PACKAGESAuthor: Terry Burnette et al.
Company: Freescale Semiconductor, Inc.
Date Published: 9/25/2005 Conference: SMTA International
The results of experiments for both assembly and for solder-joint reliability show that PQFN packages can be successfully assembled to boards and that the solder-joint reliability for the packages is acceptable for a wide range of consumer and automotive products.
Key words: QFN, PQFN, leadless, solder-joints, reliability, HSOP
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