SMTA International Conference Proceedings


Authors: Vern Solberg and Ignacio Osorio
Company: Tessera, Inc.
Date Published: 9/25/2005   Conference: SMTA International

Abstract: The industry is expecting that IC package developers will furnish more functionality and higher performance with each new generation of product offering. Simultaneously, companies supplying electronic components to the International market are making a number of material changes in order to achieve compliance with the European Unions’ "Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" (The RoHS Directive). Foremost in achieving compliance, manufacturers will need to adapt solder processes that use alloy compositions that are, to the most part, free of lead.

In addressing the increased functionality requirement, some IC manufacturers have achieved reasonable success by stacking one die on top of the other. Die-stack package assembly yield, however, is somewhat dependent on the functionality of the bare die. That is, if all die are not thoroughly tested before assembly, (especially for highperformance memory) die-stack package failure may exceed acceptable levels.

As an alternative to die-stacking, Tessera has developed a more practical method of stacking of pre-packaged and tested devices. The following text will describe the development and qualification test program for a RoHS compliant, vertically configured µZ®-Ball Stack package technology.

Key words: Chip Scale, Ball Grid Array, 3D Packaging

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