QUALIFICATION TESTING OF Pb-FREE ASSEMBLIES USING BALL STACKED CHIP SCALE IC PACKAGINGAuthors: Vern Solberg and Ignacio Osorio
Company: Tessera, Inc.
Date Published: 9/25/2005 Conference: SMTA International
In addressing the increased functionality requirement, some IC manufacturers have achieved reasonable success by stacking one die on top of the other. Die-stack package assembly yield, however, is somewhat dependent on the functionality of the bare die. That is, if all die are not thoroughly tested before assembly, (especially for highperformance memory) die-stack package failure may exceed acceptable levels.
As an alternative to die-stacking, Tessera has developed a more practical method of stacking of pre-packaged and tested devices. The following text will describe the development and qualification test program for a RoHS compliant, vertically configured µZ®-Ball Stack package technology.
Key words: Chip Scale, Ball Grid Array, 3D Packaging
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