ASSEMBLY AND BOARD LEVEL RELIABILITY CONSIDERATIONS FOR 0.4 MM PITCH BALL GRID ARRAY PACKAGESAuthors: J. Scanlan, A. Syed, WJ. Kang, and M. Abe et al.
Company: Amkor Technology, Inc.
Date Published: 9/25/2005 Conference: SMTA International
This paper describes the assembly challenges and surface mount process requirements for fine pitch ball grid array packages. Board level reliability data for 0.4 mm ball array pitch VFBGA packages will be presented, including accelerated temperature cycling, cyclic bending and drop testing.
Key words: 0.4 mm pitch, VFBGA, board level reliability
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