SMTA International Conference Proceedings


ASSEMBLY AND BOARD LEVEL RELIABILITY CONSIDERATIONS FOR 0.4 MM PITCH BALL GRID ARRAY PACKAGES

Authors: J. Scanlan, A. Syed, WJ. Kang, and M. Abe et al.
Company: Amkor Technology, Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Miniaturization of portable consumer electronics such as cell phones, PDAs, digital still cameras, and MP3 players continues to push the limits of I/O per unit area in semiconductor packaging. Just as the board level assemblers, package assemblers, PWB and substrate manufacturers have become proficient with 0.5 mm pitch ball grid arrays, the need for the next generation, 0.4 mm ball grid array pitch, emerges.

This paper describes the assembly challenges and surface mount process requirements for fine pitch ball grid array packages. Board level reliability data for 0.4 mm ball array pitch VFBGA packages will be presented, including accelerated temperature cycling, cyclic bending and drop testing.

Key words: 0.4 mm pitch, VFBGA, board level reliability



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