REWORKABLE NO-FLOW UNDERFILLING FOR BOTH TIN-LEAD AND LEADFREE REFLOW ASSEMBLED UNDER AIRAuthors: Dr. Wusheng Yin and Dr. Ning-Cheng Lee
Company: Indium Corporation of America
Date Published: 9/25/2005 Conference: SMTA International
In particular, those novel materials exhibit very wide processing windows, as reflected by their great tolerance toward variation in volume and pattern of underfill dispensed, humidity, reflow window, thermal aging, and a variety of surface finishes, accordingly can be easily utilized for double-sided reflow under air for a wide variety of surface finishes. Most noteworthily, these no-flow underfills are easily reworkable, thus further promise reduction of manufacturing cost.
Key words: no-flow underfill, reworkable, tin-lead, leadfree, reflow, solder, SMT, CSP
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.