SMTA International Conference Proceedings


RELIABILITY OF SAC BGA USING SnPb PASTE FOR HARSH ENVIRONMENT ELECTRONICS

Authors: John L. Evans, Ph.D et al.
Company: Auburn University
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Lead free soldering is replacing tin lead soldering in electronics manufacturing at a mixed pace. The International Printed Circuits (IPC) society estimates that in 2005 over 50% of all Japanese soldering was lead free while North American electronics manufacturing used only 7% lead free solder. The 2006 European Union requirements of lead free and certain US requirements will certainly require more lead free application in the near future. [1]

While the move to lead free solder will grow over the next five years, there are many applications where lead free solder will not be required or practical. Many of these applications involve harsh environment electronics. However, these same applications may be forced to use packages designed for lead-free soldering due to component availability.

This paper investigates the impact on component reliability of using lead-free solder (SnAgCu) balls for plastic ball grid array packages with SnPb (63/37) solder. The component reliability for these packages is investigated for high temperature applications (-40C to +125C). Also investigated is the impact of different printed circuit board platings on component reliability.

Key words: BGA, Lead-free, Harsh Electronics, Automotive



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