RELIABILITY OF SAC BGA USING SnPb PASTE FOR HARSH ENVIRONMENT ELECTRONICSAuthors: John L. Evans, Ph.D et al.
Company: Auburn University
Date Published: 9/25/2005 Conference: SMTA International
While the move to lead free solder will grow over the next five years, there are many applications where lead free solder will not be required or practical. Many of these applications involve harsh environment electronics. However, these same applications may be forced to use packages designed for lead-free soldering due to component availability.
This paper investigates the impact on component reliability of using lead-free solder (SnAgCu) balls for plastic ball grid array packages with SnPb (63/37) solder. The component reliability for these packages is investigated for high temperature applications (-40C to +125C). Also investigated is the impact of different printed circuit board platings on component reliability.
Key words: BGA, Lead-free, Harsh Electronics, Automotive
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