EFFECT OF BALL SIZE ON UNDERCOOLING OF Sn-Ag-Cu SOLDER JOINTSAuthors: R. Kinyanjui, L. P. Lehman, and E. J. Cotts
Company: Binghamton University
Date Published: 9/25/2005 Conference: SMTA International
A dependence of the undercooling temperature on sample size was observed for Sn, Sn-3.9Ag-0.6Cu (wt.%), and eutectic Pb-Sn samples. Corresponding results were observed for the solidification of 88 solder bumps of Sn-3.5Ag-1.0Cu (wt.%) solder alloys reflowed onto Cu/Ni/Al metallization pads. These samples displayed a median undercooling of about 60oC for a cooling rate of 1.0oC/s.
Key words: Size, undercooling, Sn dendrites, microstructure.
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