ACCELERATION FACTOR TO RELATE THERMAL CYCLES TO POWER CYCLES FOR CERAMIC AREA ARRAY PACKAGESAuthors: Andrew Perkins and Suresh K. Sitaraman
Company: Georgia Institute of Tech.
Date Published: 9/25/2005 Conference: SMTA International
The new AF is based on relevant design parameters such as substrate size, substrate thermal conductivity, CTE mismatch, board thickness, and environmental parameters such as temperature range, frequency of cycles, and peak/junction temperature. Finite Element Models (FEM), experimental data, Design of Simulation (DOS), and regression analysis are used to develop the new AF. The new AF can be used to more accurately assess PC fatigue life from ATC tests so that expensive over designing of electronic packages can be avoided for desktop/server/laptop applications.
Key words: solder joint fatigue, Accelerated Thermal Cycling ATC, Power Cycling PC, Acceleration Factor AF
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