CHARACTERIZATION OF SOLDER JOINT STRENGTH FOR HIGH I/O FCBGA PACKAGE WITH VARIOUS COMPRESSIVE LOAD FORCES AND COMPONENT PAD SURFACE FINISHESAuthors: X. Zhou, J. Bath, K. Hyland, and D. Willie et al.
Company: Solectron Corporation
Date Published: 9/25/2005 Conference: SMTA International
For surface finish studies, ATC and bend testing were utilized to compare the impact of Electroless Ni Immersion Au (ENIG) and SnPb Solder On Pad (SOP) surface finish. For heatsink studies, a compressive load force system was designed to set various load levels on the FCBGAs that were put into the ATC oven. Cross-section, dye and pry, and C-SAM techniques were employed to investigate the failure modes. Statistical analysis of the test results will be presented.
Key words: Compressive load force, High I/O FCBGA, ENIG, Solder On Pad (SOP)
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