SMTA International Conference Proceedings


CHARACTERIZATION OF SOLDER JOINT STRENGTH FOR HIGH I/O FCBGA PACKAGE WITH VARIOUS COMPRESSIVE LOAD FORCES AND COMPONENT PAD SURFACE FINISHES

Authors: X. Zhou, J. Bath, K. Hyland, and D. Willie et al.
Company: Solectron Corporation
Date Published: 9/25/2005   Conference: SMTA International


Abstract: High I/O flip chip BGA (FCBGA) is gaining more ground in the market due to the growing need of high-density interconnection and complex functions. Its large I/O number and large body size (up to 2000+ I/O and 50mm2) create additional challenges to reliability in comparison to BGA of smaller size. This paper presents the impact of two factors on solder joint mechanical strength and accelerated thermal cycling (ATC) test reliability of high I/O FCBGA: the surface finish of FCBGA pad, and compressive load forces induced by heatsink attachment.

For surface finish studies, ATC and bend testing were utilized to compare the impact of Electroless Ni Immersion Au (ENIG) and SnPb Solder On Pad (SOP) surface finish. For heatsink studies, a compressive load force system was designed to set various load levels on the FCBGAs that were put into the ATC oven. Cross-section, dye and pry, and C-SAM techniques were employed to investigate the failure modes. Statistical analysis of the test results will be presented.

Key words: Compressive load force, High I/O FCBGA, ENIG, Solder On Pad (SOP)



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