SMTA International Conference Proceedings


ASSEMBLY OF RFID FLIP CHIPS ON STRAPS USING A HIGH SPEED CHIPSHOOTER

Authors: Richard Boulanger and Peter Borgesen et al.
Company: Universal Instruments Corp.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: This article proposes an approach to high volume RFID assembly that leverages the existing electronics packaging technologies and associated infrastructure. This is illustrated by reference to a prototype line established in Binghamton, NY. Several challenges and considerations are discussed.

Meeting the ubiquitous nickel per RFID tag cost target requires the development of new very high-speed assembly methods and processes. The basis for our approach is to first assemble the chips on straps, thus achieving the high placement density needed to take full advantage of a new high-accuracy chipshooter. These straps can then subsequently be placed on antennas and inserted into labels using a flexible printing press. This approach can be very cost competitive and more mainstream than current alternatives.

Key words: High-speed RFID assembly, RFID Inlay Insertion.



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