A NEW GENERATION OF CONDUCTIVE INKS FOR ENHANCED PERFORMANCE IN SMART LABEL APPLICATIONSAuthor: Paul Berry et al.
Company: Dow Corning Corporation
Date Published: 9/25/2005 Conference: SMTA International
A key to realizing that prediction will be the ongoing evolution of new materials and assembly technologies that can help reduce card and label costs, increase capacity and improve overall reliability. In particular, as the number of applications and volumes grow, reliability has become a fundamental issue. End users are demanding more robust smart cards and labels that deliver greater flexibility and durability, with a reduced failure rate.
Recent material advancements have produced a new family of highly conductive silver inks for smart card and label antennas that achieve significantly better and more stable electrical performance, using lower antenna profiles. Low temperature cure/dry cycles and thinner traces contribute to faster, more efficient processing, helping to achieve throughput rates needed to meet projected global demands. Both the performance and processing gains contribute to lower cost-of-ownership.
Key words: RFID, smart card, smart label, conductive ink, silver ink
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