Author: W.H. Müller Company: Heriot-Watt University Date Published: 1/25/2000
Pan Pacific Symposium
Abstract: This paper presents a detailed numerical, non-linear Finite Element (FE) analysis of three different CSPs which use PI flex, an Alumina ceramic, or a BT resin as interposer mate-rial. Lifetime predictions (number of cycles to failure) are carried out on the basis of equivalent creep strains accu-mulated during Thermal Cycle Tests (TCTs). Moreover, the development of temperature profiles under Power Cycle Tests (PCTs) is simulated and used to predict the resulting irreversible strains within the solder bumps. The predic-tions from FE simulations are finally compared to reliability experiments (TherMoireR displacement measurements, Weibull plots of board level reliability, and distributions of crack lengths).