CASE STUDIES IN PREVENTING COMPONENT DAMAGE FROM LEAD-FREE HEATAuthors: Rahul Raut, Brian Lewis and Tom Hunsinger
Company: Cookson Electronics
Date Published: 9/25/2005 Conference: SMTA International
We show that a novel thermal management system, in the form of protective cooling caps, can facilitate efficient assembly and rework of heat-sensitive components. Challenges of processing heat-sensitive components along with the design of appropriate cooling caps are discussed in the form of ‘Case Studies’. The studies are divided into three parts: challenges in the process, process details including cooling cap designs, and results.
This technology is shown to facilitate the assembly and rework of legacy and other heat-sensitive components in lead-free reflow and rework.
Key words: Lead-free assembly, heat-sensitive components, lead-free reflow and rework, cooling / thermal caps, thermal management
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