SMTA International Conference Proceedings


CASE STUDIES IN PREVENTING COMPONENT DAMAGE FROM LEAD-FREE HEAT

Authors: Rahul Raut, Brian Lewis and Tom Hunsinger
Company: Cookson Electronics
Date Published: 9/25/2005   Conference: SMTA International


Abstract: As we adapt to lead-free processing there are a number of challenges electronics manufacturers face. The primary issue is the effect of lead-free temperatures on the assembly and rework of heat-sensitive components such as BGAs, certain QFPs, optoelectronic modules, plastic connectors, MEMS devices, stacked dies, etc. In this paper we discuss efforts made to solve these issues using an innovative thermal management approach.

We show that a novel thermal management system, in the form of protective cooling caps, can facilitate efficient assembly and rework of heat-sensitive components. Challenges of processing heat-sensitive components along with the design of appropriate cooling caps are discussed in the form of ‘Case Studies’. The studies are divided into three parts: challenges in the process, process details including cooling cap designs, and results.

This technology is shown to facilitate the assembly and rework of legacy and other heat-sensitive components in lead-free reflow and rework.

Key words: Lead-free assembly, heat-sensitive components, lead-free reflow and rework, cooling / thermal caps, thermal management



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