SMTA International Conference Proceedings


Author: Michael Havener
Company: Benchmark Electronics, Inc
Date Published: 9/25/2005   Conference: SMTA International

Abstract: The European Union’s deadline to ban lead in electronic products is quickly approaching. To meet the challenges of lead-free soldering, a method to evaluate the performance of lead-free wave solder fluxes will be explored. Identifying the optimal water-soluble and no-clean chemistries is the objective of this testing. Existing wave solder fluxes for tinlead soldering will also be evaluated as a comparison and to determine if the lead-free chemistries can meet or exceed tin-lead performance.

The evaluation process will start with the selection of materials and test vehicle followed by two test phases to down select the candidate fluxes. Testing will evaluate barrel fill, solder joint formation and solder ball formation.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819