BENCHMARKING OF LEAD-FREE NO-CLEAN FLUXES SOLDERING PERFORMANCE ON OSP BOARDAuthors: Dr. Xiaobai Wang and Christine Poon
Company: Kester Components Pte Ltd
Date Published: 9/25/2005 Conference: SMTA International
The conventional approach and common understanding in lead-free, no-clean flux selection is higher activity, higher solid content and better heat stability. However, there is no exact science in flux selection and thus, it is matter of trial and error. This paper attempts to put the flux selection in perspective in terms of various fluxes’ attributes and properties necessary for lead-free operations.
The fluxes were wavesolderedon test boards and graded on various soldering performance of icicles, bridging, solder balling, barrel fill on both leaded and lead-free wave soldering. The soldering performance will be used to address the type of no-clean flux that can qualify for lead-free operation and guide users in flux selection.
Key Words: lead-free, wave soldering, chemical flux
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