Pb-FREE PROCESS DEVELOPMENT AND MICROSTRUCTURAL ANALYSIS OF CAPACITOR FILTER ASSEMBLIES USING SOLDER PREFORMSAuthor: Vatsal A. Shah et al.
Company: Binghamton University
Date Published: 9/25/2005 Conference: SMTA International
Another promising alternative to SnPb solders is the eutectic SnAg alloy. The Pb-free alloys considered in this work have high temperature strength and high reliability for interconnect applications. We are studying a variety of factors (reflow atmosphere, and alloy composition) on the quality of the solder joints. The reflowed capacitors are cross-sectioned and polished up to 0.02 microns to check for the presence of any intermetallics or voids in the contact areas. The results obtained from the Pb-free test samples are compared to eutectic SnPb samples to study the differences between the Pb-free and SnPb processes.
Key words: Pb-free, SnAgCu, SnAg, Reflow profiling, Sn budget, Grain boundary, Cross polarized microscopy, Reliability.
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