A KINETIC APPROACH OF PROFILING FOR VOIDING CONTROL AT LEAD-FREE REFLOW SOLDERINGAuthor: Dr. Yan Liu et al.
Company: Indium Corporation of America
Date Published: 9/25/2005 Conference: SMTA International
Use of a high soaking energy can help drying out volatiles hence reduce the melting outgasing and result in low voiding, but may also increase oxidation for pastes with poor oxidation resistance and cause a high voiding. Testing oxidation resistance of solder paste beforehand will promise a more accurate selection of soaking energy.
Key words: lead-free, solder, SMT, CSP, BGA, soldering, void, voiding, reflow, profile, microvia
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