SMTA International Conference Proceedings


A KINETIC APPROACH OF PROFILING FOR VOIDING CONTROL AT LEAD-FREE REFLOW SOLDERING

Author: Dr. Yan Liu et al.
Company: Indium Corporation of America
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Voiding is attributed to the flux outgassing within the solder joints when the solder is at molten state. The effect of reflow profile on voiding at microvia for lead-free soldering is strongly dependent on the flux chemistry. In general, wetting is more important than melting outgasing behavior, and can be enhanced by employing a higher melting energy, including both higher peak temperature and longer dwell time.

Use of a high soaking energy can help drying out volatiles hence reduce the melting outgasing and result in low voiding, but may also increase oxidation for pastes with poor oxidation resistance and cause a high voiding. Testing oxidation resistance of solder paste beforehand will promise a more accurate selection of soaking energy.

Key words: lead-free, solder, SMT, CSP, BGA, soldering, void, voiding, reflow, profile, microvia



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