OPTIMIZING THE REFLOW PROCESS UTILIZING A TIN/COPPER ALLOYAuthor: Bob Gilbert
Company: FCT Assembly, Inc.
Date Published: 9/25/2005 Conference: SMTA International
Many companies desire to utilize the same alloy for all of their soldering processes to eliminate the issue of mixing alloys during immediate repair operations and when the assembly is returned from the field for repair. This paper has been developed to give a brief overview of the lead free reflow testing that has been performed on the tin/copper/nickel alloy compared to the tin/lead baseline and the more popular tin/silver/copper (SAC) alloys.
This paper will discuss the factors in optimizing lead free reflow soldering and the ability to utilize the tin/copper/nickel alloy at the industry recommended lead free reflow profiles. Results of reliability testing, void formation, microcracking, intermetallic growth, tin whisker testing, and solderability will be reviewed.
Key words: Lead Free, Tin/copper/nickel, reflow
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