SMTA International Conference Proceedings


OPTIMIZING THE REFLOW PROCESS UTILIZING A TIN/COPPER ALLOY

Author: Bob Gilbert
Company: FCT Assembly, Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: There is now legislation in place in Europe and Japan that is making the switch to lead free a requirement for many electronic assembly companies. Other countries are now considering adapting similar regulations. Understanding the technical requirements for converting to lead free will be critical to the successful implementation of this new process. With the success of the tin/copper/nickel eutectic alloy for wave soldering and HASL, there has been an increase interest in considering it for reflow soldering.

Many companies desire to utilize the same alloy for all of their soldering processes to eliminate the issue of mixing alloys during immediate repair operations and when the assembly is returned from the field for repair. This paper has been developed to give a brief overview of the lead free reflow testing that has been performed on the tin/copper/nickel alloy compared to the tin/lead baseline and the more popular tin/silver/copper (SAC) alloys.

This paper will discuss the factors in optimizing lead free reflow soldering and the ability to utilize the tin/copper/nickel alloy at the industry recommended lead free reflow profiles. Results of reliability testing, void formation, microcracking, intermetallic growth, tin whisker testing, and solderability will be reviewed.

Key words: Lead Free, Tin/copper/nickel, reflow



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819