DEVELOPMENT AND DEPLOYMENT OF LEAD-FREE ASSEMBLY PROCESS WORLD-WIDEAuthors: Kim Hyland
Date Published: 9/25/2005 Conference: SMTA International
These challenges are manifest in the migration to lead-free technology and the preparations to make far-reaching changes across the entire company. Solectron established an Environmental Compliance Team (ECT) to orchestrate the development and implementation of compliant solutions to one of the most challenging pieces of environmental legislation to ever hit the electronics industry, the European Union's Restriction of Hazardous Substances (RoHS) legislation.
The team consisted of representatives from design/engineering, materials/warehousing, operations, marketing/sales, IT, services, and legal. Additionally, each manufacturing location was required to identify a site leader responsible to communicate ECT requirements and direction, and drive all functions at the site toward RoHS readiness. This paper covers Solectron D&E effort to deploy and empirically validate lead-free soldering techniques throughout the company.
The paper describes the requirements for each production site to demonstrate process readiness through a manufacturing build consisting of lead-free surface mount and through-hole test vehicles. The paper also discusses the test vehicle build results, including solder joint reliability assessment and failure analysis findings.
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