SMTA International Conference Proceedings


DEVELOPMENT AND DEPLOYMENT OF LEAD-FREE ASSEMBLY PROCESS WORLD-WIDE

Authors: Kim Hyland
Company: Solectron
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Solectron’s Design and Engineering (D&E) team provides technology solutions to Solectron sites worldwide in support of customer needs. This development and deployment effort promotes the concept of common process and recognizes that change in one technology may dictate changes to related technologies. The activity is complicated by market pressure to introduce new and enhanced technologies faster and more frequently in response to customer demands.

These challenges are manifest in the migration to lead-free technology and the preparations to make far-reaching changes across the entire company. Solectron established an Environmental Compliance Team (ECT) to orchestrate the development and implementation of compliant solutions to one of the most challenging pieces of environmental legislation to ever hit the electronics industry, the European Union's Restriction of Hazardous Substances (RoHS) legislation.

The team consisted of representatives from design/engineering, materials/warehousing, operations, marketing/sales, IT, services, and legal. Additionally, each manufacturing location was required to identify a site leader responsible to communicate ECT requirements and direction, and drive all functions at the site toward RoHS readiness. This paper covers Solectron D&E effort to deploy and empirically validate lead-free soldering techniques throughout the company.

The paper describes the requirements for each production site to demonstrate process readiness through a manufacturing build consisting of lead-free surface mount and through-hole test vehicles. The paper also discusses the test vehicle build results, including solder joint reliability assessment and failure analysis findings.



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