SMTA International Conference Proceedings


Author: Chrys Shea et al.
Company: Cookson Electronics
Date Published: 9/25/2005   Conference: SMTA International

Abstract: A study was performed to understand the assembly constraints of the newest miniaturized package chip components, 01005 (or 0402 metric). The study included all facets of surface mount assembly: pad design and location, printability of the small deposits, placement tolerances on the components, and reflow capability of the small, lead-free deposits in an air environment. This study was a joint effort between two manufacturers: a solder paste developer and a pick and place machine supplier.

The study tested multiple solder deposit sizes as part of an effort to characterize the repeatability of the paste prints and the paste’s reflow fusion capability in air. It also tested several component placement orientations and offsets, and multiple padstacks. The result shows strong feasibility of 01005 devices in modern assembly systems, and discusses the parameters that produced the best results in the system under consideration.

Keywords: Lead-Free, SMT Assembly, Miniaturization, 01005

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