A FEASIBILITY STUDY OF 01005 CHIP COMPONENTS IN A LEAD-FREE SYSTEMAuthor: Chrys Shea et al.
Company: Cookson Electronics
Date Published: 9/25/2005 Conference: SMTA International
The study tested multiple solder deposit sizes as part of an effort to characterize the repeatability of the paste prints and the paste’s reflow fusion capability in air. It also tested several component placement orientations and offsets, and multiple padstacks. The result shows strong feasibility of 01005 devices in modern assembly systems, and discusses the parameters that produced the best results in the system under consideration.
Keywords: Lead-Free, SMT Assembly, Miniaturization, 01005
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.