iNEMI LEAD-FREE MICRO-BGA, CBGA, MICTOR CONNECTOR AND THROUGH-HOLE DIP REWORK EVALUATIONSAuthor: Jasbir Bath et al.
Company: Solectron Corporation
Date Published: 9/25/2005 Conference: SMTA International
This paper will present the Tin-lead and Lead-free rework development processes developed on the Phase 1 boards for the Mictor connector component as well as highlighting and analyzing certain areas of concern caused by reflow issues for adjacent CBGA parts during Micro-BGA rework, and reduced holefill during mini-pot rework activities on DIP16 components for the Phase 2 iNEMI Payette board.
Keywords: Rework, Lead-free, Connector, BGA
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