SMTA International Conference Proceedings


Author: Jasbir Bath et al.
Company: Solectron Corporation
Date Published: 9/25/2005   Conference: SMTA International

Abstract: A team of iNEMI (InterNational Electronics Manufacturing Initiative) companies collaborated to develop Tin-lead and Lead-free rework processes for double-sided printed circuit boards in three thicknesses (0.062", 0.093" and 0.135") with electrolytic NiAu and Immersion Ag surface finishes. As a prelude to the rework development of the iNEMI Payette designed test board in Phase 2 an initial rework development phase was conducted (Phase 1). The initial phase was performed on a HP "Yunque" test board with similar board characteristics to the Payette board. One of the components for rework development in Phase 1 was a 5-segment Mictor connector.

This paper will present the Tin-lead and Lead-free rework development processes developed on the Phase 1 boards for the Mictor connector component as well as highlighting and analyzing certain areas of concern caused by reflow issues for adjacent CBGA parts during Micro-BGA rework, and reduced holefill during mini-pot rework activities on DIP16 components for the Phase 2 iNEMI Payette board.

Keywords: Rework, Lead-free, Connector, BGA

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