SMTA International Conference Proceedings


COMPONENTS & LEADED SURFACE MOUNT PACKAGES

Author: Alan Donaldson
Company: Intel Corporation
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Due to pending legislation in Europe, Japan and the USA, the electronic industry is converting to lead-free (LF) solders. This paper focuses on hand solder rework of LF two pin through-hole (TH) components, leaded surface mount packages and small passive components soldered to Printed Circuit Boards (PCB), using high temperature solder tips. A tin/silver3.8/copper0.7 core solder wire alloy was used for all the hand rework soldering. Hand solder rework was done on a variety of board sizes with most of the work done on Immersion Silver (ImAg) PCB surface finishes. The board thickness range was from 62 mils (0.062in) to 93 mils (0.093in).

Fully functional and daisy chain test boards were used for all hand solder rework development. A wide variety of component surface finishes were also used. Component surface finishes ranged from tin to silver to tin-bismuth. Many components were put through a series of reliability tests that included temperature cycling, static bake, humidity, mechanical shock and vibration. Functional boards were powered on and ran through systems tests. Daisy chained boards were tested for opens and shorts. From the results obtained, it was ascertained that lead-free hand solder rework can be reliably done.

Key words: Lead-free rework, hand soldering, solder joints, LF rework reliability.



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