SMTA International Conference Proceedings


ASSESSING THE RELIABILITY OF NEW CONNECTOR DESIGNS

Authors: Heather McCormick and George Riccitelli
Company: Celestica Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: As electronic packages decrease in size and pitches decline, daughter cards have become popular methods for creating "islands of density" on larger boards as a means of simplifying the motherboard and reducing their cost. Connector suppliers have responded to this trend by creating BGA type board-toboard connectors. Further, to eliminate the need to wave solder connectors and simplify the process, BGA connectors and press fit connectors have been used.

The manufacturability of these connectors has been evaluated and documented previously; however, there is a need to study the second-level reliability of these connectors. This paper will focus on the reliability data generated from the accelerated thermal cycling of the "Metropolis" test vehicle, which was performed using IPC-9701 as a guideline. The "Metropolis" test vehicle incorporates two styles of BGA mezzanine connectors, a BGA mounted socket, and press fit connectors.

In addition, assembly results related to a lead free version of one of the press fit connectors have been studied, and reliability data for this connector will be generated. None of the other connectors studied was available at the time of assembly in a lead free version - they will be included in future projects once they are available.

Key words: BGA Connectors, Press Fit Connectors



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