Pan Pacific Symposium Conference Proceedings


Author: Paul Mescher
Company: Amkor Technology
Date Published: 1/25/2000   Conference: Pan Pacific Symposium

Abstract: Flip chip interconnect is beginning to appear in a variety of package formats. Early discussions of flip chip in package (FCIP) often revolved around a simple package concept, generally patterned after classic C4 ceramic packaging, with the primary drive toward using flip chip expected to be electrical performance. It is becoming clear, however, that demand for FCIP is being driven by a number of factors, from all corners of the silicon industry, which is causing flip chip to be considered across most of the same package platforms as wirebond. To accurately understand the benefits of FC for a given application, one must consider several factors, including electrical performance, physical dimension requirements, and total cost of ownership (package and silicon cost combined) to determine if using flip chip is advantageous in a given system. FCIP packages now exist from 30 lead CSP’s to 2000+ lead BGA’s, with a wide range in between. Substrate technology has moved from traditional ceramic into a wide range of organic options, enabling a multitude of different package applications built around a flip chip technology. This paper will discuss several current and upcoming flip chip in package options, including specific mechanical attributes that provide application advantage. Each package type will be presented in terms of both overall package construction, reliability, and performance attributes significant to end user requirements.

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