SMTA International Conference Proceedings


CASE STUDY IMPLEMENTATION OF LOW SOLIDS VOC COMPLIANT CLEANING TECHNOLOGY AT A LARGE EMS OPERATION

Authors: Tom Gervascio and Mike Bixenman
Company: Honeywell Aerospace and Kyzen
Date Published: 9/25/2005   Conference: SMTA International


Abstract: In the era of no clean, high reliability electronic assemblies require removal of flux residue and other residual contaminates, even while many other assemblies support a true no-clean process. Miniaturization and reliability concerns drive more customers to specify cleaning as a required step in the manufacturing process. The problem is that cleaning performance changes when processing Pb-free, different flux types, tightly dense substrates, and boards assembled with advanced packages. EMS providers require cleaning technologies that work well on a range of flux technologies, drop into industry standard cleaning equipment, and provide a low cost of ownership while controlling variability and meeting increasingly stringent environmental laws.

This paper presents a case study, of a recognized EMS provider’s implementation of a low solids VOC compliant cleaning technology. It offers a clear methodology to remove solder paste and flux residue as well as characterizing the performance of in-line cleaning systems. Cleaning materials that address environmental concerns must achieve functionality while using less active chemical material in the engineered cleaning design. This challenge narrows the process window, which increases the need to reduce variability in the process. The paper discusses challenges and lessons learned from implementation to standardization.

Key Words: Cleaning, Class 3, Pb-free



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