SMTA International Conference Proceedings


ONE PROCESS, DIFFERENT RESULTS: METHODOLOGIES FOR ANALYZING A STENCIL PRINTING PROCESS USING PROCESS CAPABILITY INDEX ANALYSES

Author: Daryl L. Santos et al.
Company: Binghamton University
Date Published: 9/25/2005   Conference: SMTA International


Abstract: The purpose of this paper is to compare and contrast different stencil printing process capability results that can be obtained from the same data points, depending upon how the data are analyzed. In estimating a printing process’ capability to deposit solder paste, it is a common practice (see Mukadam et al. (2002) for example) to utilize process capability indices (like Cp, Cpk, and others).

One set of data, depending upon how it is analyzed, can actually provide different values for the index being investigated. For example, if one is interested in the capability of the process for meeting the specifications on one particular component, different results could be obtained if the data were analyzed in the following ways: board-to-board, all deposits, parallel vs. perpendicular pad orientation (w.r.t. squeegee blade direction), and others.

This paper will provide an example case study and show that one process, depending upon how it is viewed or analyzed, will in fact produce various results via process capability index analysis.

Key words: Process Capability, Stencil Printing



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