CHARACTERIZING TRANSFER EFFICIENCIES AND THE FINE FEATURE STENCIL PRINTING PROCESSAuthors: Chrys Shea, Greg Wade, Esse Leak, and Ron Tripp
Company: ALPHA - A Cookson Company
Date Published: 9/25/2005 Conference: SMTA International
Stencil printing research over the past four years has aided in demystifying the printing process by understanding the influence of the stencil manufacturing process, providing models to predict actual volumes of fine features, improving stencil-PWB alignment, maintaining stencil aperture libraries, and maximizing lead-free cosmetics and yields. The most recent research has been focused on improving fine feature prints on boards that require thick stencils and modeling transfer efficiencies of modern pastes.
Key words: Stencil printing, transfer efficiency, fine features, aperture design, MicroStep pockets, lead-free
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