STUDY OF NOISE FACTORS IN SOLDER PASTE PRINTINGAuthors: Aleksandra Djordjevic
Company: Delphi Electronics & Safety
Date Published: 9/25/2005 Conference: SMTA International
The goal of this study was not only to optimize a typical printing process by adjusting parameters from the machine selection menu, but also to study the underlying noise factors and quantify their impacts on the process output. A Six Sigma structured approach was used to identify the greatest sources of variation of the solder paste printing process.
Key words: solder paste printing, noise factors, six sigma, design of experiment.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.