SMTA International Conference Proceedings


Authors: Aleksandra Djordjevic
Company: Delphi Electronics & Safety
Date Published: 9/25/2005   Conference: SMTA International

Abstract: Although Surface Mount Technology (SMT) processes have been in use since the 1960’s, continuous process improvement and increasing product quality demands are causing revived interest in the solder paste printing process.

The goal of this study was not only to optimize a typical printing process by adjusting parameters from the machine selection menu, but also to study the underlying noise factors and quantify their impacts on the process output. A Six Sigma structured approach was used to identify the greatest sources of variation of the solder paste printing process.

Key words: solder paste printing, noise factors, six sigma, design of experiment.

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