SMTA International Conference Proceedings


STUDY OF NOISE FACTORS IN SOLDER PASTE PRINTING

Authors: Aleksandra Djordjevic
Company: Delphi Electronics & Safety
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Although Surface Mount Technology (SMT) processes have been in use since the 1960’s, continuous process improvement and increasing product quality demands are causing revived interest in the solder paste printing process.

The goal of this study was not only to optimize a typical printing process by adjusting parameters from the machine selection menu, but also to study the underlying noise factors and quantify their impacts on the process output. A Six Sigma structured approach was used to identify the greatest sources of variation of the solder paste printing process.

Key words: solder paste printing, noise factors, six sigma, design of experiment.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819