INTEGRATION OF ACTIVE AND PASSIVE COMPONENTS USING CHIP IN POLYMER TECHNOLOGYAuthor: Lars Boettcher et al.
Company: Fraunhofer IZM Berlin
Date Published: 9/25/2005 Conference: SMTA International
A further miniaturization however requires a 3-dimensional integration of active and passive components. Additionally the signal frequencies will increase to several GHz in high speed digital applications. In order to maintain signal integrity, much shorter and impedance-matched interconnects between chips and passive components are required. In this paper a new approach will be described which allows both extreme dense 3-dimensional integration and very short interconnects.
This approach, called "Chip in Polymer" is based on the integration of thin components into build-up layers of printed circuit board. Beside the process technology this paper will emphasize on the needed wafer preparation.
Keywords: 3D packaging, embedded chips, Chip in Polymer
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