ADHESIVE FLIP CHIP FOR LARGE ARRAYED DEVICESAuthor: James E. Clayton
Company: Polymer Assembly Technology
Date Published: 9/25/2005 Conference: SMTA International
A simple yet effective solution combines gold wirebond stud bumps with stencil printed isotropic conductive adhesives (ICA) that can be assembled with low pressure and cured at temperatures below 80C. Although the present market for ICA adhesives is dominated by silver-flake thermoset epoxies, other materials such as carbon nanotubes and platinum flake are being evaluated for applications where silver may not be compatible. Some examples would include biomedical implant devices and large arrayed X-ray detectors.
This paper provides an overview of these and other applications that are a good fit for adhesive flip chip assembly.
Key words: adhesive flip chip, gold (Au) stud bumping, isotropic conductive adhesives (ICA), Indium Bump Bonding, Hybridization., imaging detectors.
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