SMTA International Conference Proceedings


Author: James E. Clayton
Company: Polymer Assembly Technology
Date Published: 9/25/2005   Conference: SMTA International

Abstract: A large variety of digital imaging sensors are emerging for medical, homeland security and deep space observation that require flip chip assembly. These sensors are often fabricated from materials that are too temperature sensitive to expose to reflow-profiles used when soldering with leadfree alloys. Indium bump bonding, or hybridization, is one low-temperature alternative but is often too expensive or high-risk for these fragile compound semiconductor devices.

A simple yet effective solution combines gold wirebond stud bumps with stencil printed isotropic conductive adhesives (ICA) that can be assembled with low pressure and cured at temperatures below 80C. Although the present market for ICA adhesives is dominated by silver-flake thermoset epoxies, other materials such as carbon nanotubes and platinum flake are being evaluated for applications where silver may not be compatible. Some examples would include biomedical implant devices and large arrayed X-ray detectors.

This paper provides an overview of these and other applications that are a good fit for adhesive flip chip assembly.

Key words: adhesive flip chip, gold (Au) stud bumping, isotropic conductive adhesives (ICA), Indium Bump Bonding, Hybridization., imaging detectors.

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