FLIP CHIP ULTRASONIC GOLD TO GOLD INTERCONNECT FOR SMALL DIE WITH HIGH BUMP COUNTAuthor: Philip Couts
Company: TDK Corporation of America
Date Published: 9/25/2005 Conference: SMTA International
Ultrasonic GGI bonders use a built in monitoring function for each die bond. Collapse height and impedance can be "mapped" for each die bond location in real time. Using the built in process each die location characteristics can be mapped. The map data is stored as a monitor text log file for easy access by other windows based programs.
Gold bonds provide superior bond strength because of the monolithic structure of the gold material. Gold bonds also have superior high frequency performance and low resistance when compared to solder or conductive materials. Die size reductions are achieved with flip chip ultrasonic GGI process when compared to wire bonding. The GGI ultrasonic GGI process reliably handles gold bump pitches of 100 µm or less in high volume manufacturing. This process capability has allowed die size reductions up to 70% when compared to wire bonding or C4 solder flip chip process.
Flip Chip ultrasonic GGI process can bond die with thickness as thin as 100 µm. This has been an important benefit for mobile products where low profile is critical. Low cost organic substrate materials and embedded passive LTCC substrates are used in flip chip ultrasonic GGI device manufacturing. Because the GGI ultrasonic GGI process relies on solid phase welding of the die to the substrate, relatively low bonding temperatures <150° C is used allowing it to be an excellent choice for substrate materials sensitive to heat.
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