GOLD BUMP TECHNOLOGIES: A COMPARISON OF SERIAL PROCESSING (BALL BUMPING) AND BATCH PROCESSING (PLATING)Authors: Daniel Evans, Jr. and Mark S. Greenwell
Company: Palomar Technologies, Inc.
Date Published: 9/25/2005 Conference: SMTA International
Key words: Chip, FCA, Interconnect, DCA, UBM, GGI, Plated Bump, Ball Bump, Stud Bump, Wafer Level Package.
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