SMTA International Conference Proceedings


GOLD BUMP TECHNOLOGIES: A COMPARISON OF SERIAL PROCESSING (BALL BUMPING) AND BATCH PROCESSING (PLATING)

Authors: Daniel Evans, Jr. and Mark S. Greenwell
Company: Palomar Technologies, Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: Ball bumping can provide an engineer several advantages over plated-up bumps for several reasons: ball bumps can be more cost effective than plated bumps; ball bumps can support multiple substrate attach technologies; single pass ball bump shapes are available without the planarization requirement; and ball bumping offers a technique for manufacturing unique thin flat pancake shaped bumps and other shapes.

Key words: Chip, FCA, Interconnect, DCA, UBM, GGI, Plated Bump, Ball Bump, Stud Bump, Wafer Level Package.



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