Medical Electronics Symposium Conference Proceedings


MINIATURE IC PACKAGE INNOVATIONS FOR ADVANCED MEDICAL ELECTRONIC APPLICATIONS

Authors: Vern Solberg and Mike Perry
Company: Tessera, Inc.
Date Published: 4/25/2005   Conference: Medical Electronics Symposium


Abstract: With each generation of electronics developed for medical applications, companies’ are attempting to reduce the product size or offer more and more features and/or capability. And even though the actual functionality of the new product offering may expand, the customer is expecting each generation to be smaller and lighter that its predecessor. More functionality typically requires additional or more complex electronics; however, additional functionality can adversely impact both product size as well as manufacturing cost.

Another issue companies will face is the inevitable point of product obsolescence. A growing number of older medical electronics will need to be upgraded or even replaced with more current technology because they are often bulky in size, more difficult to handle and, most alarming, less reliable. This is often driven by the reality that some older technologies are reaching the point of ‘wear out’ and components for repair are no longer available. This factor alone can lead to extensive reengineering and product redesign.

The challenge the medical electronic developer faces when competing in this very specialized field is to offer a product that will meet all performance and functionality expectations in a form factor that is significantly smaller and lighter than the product it’s replacing. Simultaneously, the newer generation of electronic assemblies must exhibit a higher level of reliability and, for system level products, have minimal down time in the field.

The medical electronic industry has traditionally relied on two options for adapting active silicon die functions; commercial plastic encapsulated devices or the uncased bare die. The commercial package has the advantage of being fully tested before board level assembly but its somewhat bulky size limits the product designers’ ability to reach the more aggressive requirement for smaller size.

In this paper the author will explore a number of commercially available chip-scale µBGA® package solutions and miniature µZ® folded and stacked multiple die system level applications developed within Tessera’s Package Engineering Service Laboratories. In addition, results of extensive physical stress testing and data compiled comparing eutectic solder assembly processing to lead-free solder assembly processing.

Key words: BGA, µBGA, CSP, 3D Packaging, Ball Stack Packaging, µZ BGA.



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