THE IMPORTANCE OF REFLOW PROFILE QUALIFICATION, THERMAL PROCESS TRACEABILITY AND CONTROLAuthor: Mark Pulis
Date Published: 4/25/2005 Conference: Medical Electronics Symposium
Many reflow documentation systems merely record the date and time a product was reflowed, and whether the oven recipe and temperatures were correct. The assembler must periodically run a profile to verify that nothing has changed in the process. The assumption is, if the test board is within spec, all the production boards should be within spec. What is needed is a means of tracing the thermal specifications for every board processed.
Hardware and software technology now make it possible not only to optimize the reflow setup, but then to automatically monitor the reflow portion of the SMT line at a previously unimagined level. This technology includes a statistical method for quantifying reflow process performance, which allows a simple and efficient application of Statistical Process Control to the reflow process. Below are the three areas of automated reflow management, which we will analyze in detail.
By adding an automated reflow management tool to an existing oven, the manufacturer can maintain control of the reflow process, while documenting the critical process parameters.
Key words: Profile, Virtual Profile, PWI, Documentation.
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