Pan Pacific Symposium Conference Proceedings


Author: Ashraf Lotfi
Company: Bell Laboratories
Date Published: 1/25/2000   Conference: Pan Pacific Symposium

Abstract: We present a unified magnetic-electrical-thermal package design for a power magnetic and semiconductor device, along with some of its associated manufacturing issues for use in very dense, low profile power converters. The packaged power magnetic-semiconductor device includes: (1) an isolation transformer, (2) a semiconductor switch, (3) a rectifier on the secondary side and (4) an encapsulant surrounding the transformer, the switch and the rectifier joining them into a single integrated package. This package has the means for a thermal path to the external environment. We study the impact of this device on power density, electrical and thermal performance.

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