ASSEMBLY CONCERNS FOR TEST IN STRIPAuthor: Bob Fenton
Company: Electroglas, Inc.
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
As more manufacturers adopt strip testing, greater throughput and flexibility will be required to deal with the dual challenges of increasing cost pressure for metal lead frame devices and the difficulties of contacting the geometries of the latest generation of chip scale packaging. Additionally, new assembly parameters must be considered as they relate to suitability to implement strip testing.
This paper examines the implications of assembly methodology on strip testing. First a short overview of why strip testing is becoming more prevalent followed by case studies of actual strip test implementations. Assembly characteristics such as strip or substrate construction, density and geometry are discussed, emphasizing their effects on overall final test efficiency for several different device types, packages and assembly parameters.
Key words: Final Test, Leadframe, Strip, Matrix, Handler, Wafer Prober.
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